Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies ( Mechanical Engineering) [Karl J. Puttlitz, Kathleen A. Stalter] on leondumoulin.nl
Table of contents

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Handbook Of Lead-Free Solder Technology For ...

Add to Wish List. Toggle navigation Additional Book Information. Description Table of Contents Reviews. Features Analyzes the health risks associated with lead Estimates the environmental benefits of using lead-free substitutes in microelectronics Summarizes new regulations, legislation, and marketplace trends affecting the industry Outlines changes and challenges to the materials, equipment, and processes for manufacture of lead-free microelectronics Summary This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications.

SearchWorks Catalog

Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics. Table of Contents Background and Driving Forces.

Materials and Manufacturing Considerations.

Handbook of lead-free solder technology for microelectronic assemblies in SearchWorks catalog

Reviews "[This book] is a complete primer that provides thorough and comprehensive knowledge to electronic manufacturers engaged in developing, manufacturing and utilizing lead free solder technologies in microelectronic assemblies. The book is a comprehensive review of all aspects related to the development of lead-free solders, and the editors are commended for including global efforts along these lines…The editors succeeded in meeting their goals of making this book useful to folks concerned about electronic solders-scientists, researchers, managers, and marketing personnel, as well as students working toward advanced degrees…This is an excellent sequel [that] should be on the shelf of everyone working on microelectronics solders and packaging.

It is strongly recommended as an addition to your bookshelf as there are lots of practical issues covered often overlooked by others. Report wrong cover image.


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1st Edition

Responsibility edited by Karl J. Physical description xi, p.


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Series Mechanical engineering Marcel Dekker, Inc. Find it at other libraries via WorldCat Limited preview. Contributor Puttlitz, Karl J.

Tinman Electronics 3 - First time lead-free solder user

Contents Background and Driving Forces.